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Copy pathBNO055.kicad_mod
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BNO055.kicad_mod
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(module BNO055 (layer F.Cu) (tedit 5939F8B7)
(attr smd)
(fp_text reference LGA28R50P4X10_380X520X100 (at 1.04 -2.835) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.05)))
)
(fp_text value VAL** (at 0.475 2.665) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.05)))
)
(fp_line (start -2.9 -2.2) (end 2.9 -2.2) (layer F.SilkS) (width 0.127))
(fp_line (start 2.9 -2.2) (end 2.9 2.2) (layer F.SilkS) (width 0.127))
(fp_line (start 2.9 2.2) (end -2.9 2.2) (layer F.SilkS) (width 0.127))
(fp_line (start -2.9 2.2) (end -2.9 -2.2) (layer F.SilkS) (width 0.127))
(fp_circle (center -2.2 -2.3) (end -2.1 -2.3) (layer F.SilkS) (width 0.3048))
(pad 1 smd rect (at -2.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.3125 -0.75 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.3125 -0.25 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.3125 0.25 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at -2.3125 0.75 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at -2.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at -1.75 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at -1.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at -0.75 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 10 smd rect (at -0.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 11 smd rect (at 0.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 12 smd rect (at 0.75 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 13 smd rect (at 1.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 14 smd rect (at 1.75 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 15 smd rect (at 2.25 1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 16 smd rect (at 2.3125 0.75 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 17 smd rect (at 2.3125 0.25 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 18 smd rect (at 2.3125 -0.25 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 19 smd rect (at 2.3125 -0.75 270) (size 0.3 0.425) (layers F.Cu F.Paste F.Mask))
(pad 20 smd rect (at 2.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 21 smd rect (at 1.75 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 22 smd rect (at 1.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 23 smd rect (at 0.75 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 24 smd rect (at 0.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 25 smd rect (at -0.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 26 smd rect (at -0.75 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 27 smd rect (at -1.25 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
(pad 28 smd rect (at -1.75 -1.5625 180) (size 0.3 0.525) (layers F.Cu F.Paste F.Mask))
)