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t1-report.txt
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# PCB
Board size: 63.0x35.6 mm (2.48x1.4 inches)
- This is the size of the rectangle that contains the board
- Thickness: 1.6 mm (63 mils)
- Material: FR4
- Finish: HAL
- Layers: 4
- Copper thickness: 35 µm
Solder mask: TOP / BOTTOM
- Color: Green
Silk screen: TOP / BOTTOM
- Color: White
# Important sizes
Clearance: 0.15 mm (6 mils)
Track width: 0.38 mm (15 mils)
- By design rules: 0.15 mm (6 mils)
Drill: 0.5 mm (20 mils)
- Vias: 0.5 mm (20 mils) [Design: 0.4 mm (16 mils)]
- Pads: 1.05 mm (41 mils)
- The above values are real drill sizes, they add 0.1 mm (4 mils) to plated holes (PTH)
Via: 0.8/0.4 mm (31/16 mils)
- By design rules: 0.4/0.3 mm (16/12 mils)
- Micro via: yes [0.2/0.1 mm (8/4 mils)]
- Buried/blind via: yes
- Total: 40 (thru: 40 buried/blind: 0 micro: 0)
Outer Annular Ring: 0.15 mm (6 mils)
- By design rules: 0.28 mm (11 mils)
Eurocircuits class: 6B
- Using min drill 0.5 mm for an OAR of 0.15 mm
# General stats
Components count: (SMD/THT)
- Top: 25/5 (SMD + THT)
- Bottom: 0/0 (NONE)
Defined tracks:
- 0.15 mm (6 mils)
- 0.2 mm (8 mils)
- 0.25 mm (10 mils)
- 0.38 mm (15 mils)
- 0.51 mm (20 mils)
- 0.76 mm (30 mils)
Used tracks:
- 0.38 mm (15 mils) (78) defined: yes
- 0.51 mm (20 mils) (212) defined: yes
Defined vias:
Used vias:
- 0.8/0.4 mm (31/16 mils) (Count: 40, Aspect: 2.0 A) defined: no
Holes (excluding vias):
- 0.95 mm (37 mils) (4)
- 1.0 mm (39 mils) (21)
- 2.0 mm (79 mils) (1)
- 2.3 mm (91 mils) (2)
- 2.7 mm (106 mils) (4)
Oval holes:
- 1.5x2.0 mm (59x79 mils) (1)
Drill tools (including vias and computing adjusts and rounding):
- 0.5 mm (20 mils) (40)
- 1.05 mm (41 mils) (4)
- 1.1 mm (43 mils) (21)
- 1.5 mm (59 mils) (1)
- 2.0 mm (79 mils) (1)
- 2.4 mm (94 mils) (2)
- 2.7 mm (106 mils) (4)
Solder paste stats:
Using a paste with 87.75 % alloy, that has an specific gravity for the alloy of 7.4 g/cm³
and 1.0 g/cm³ for the flux. This paste has an specific gravity of 4.15 g/cm³.
The stencil thickness is 0.12 mm.
| Side | Pads with paste | Area [mm²] | Paste [g] |
|--------|-----------------|------------|-----------|
| Total | 82 | 138.11 | 0.69 |
Note: this is just an approximation to the theoretical value. Margins of the solder mask and waste aren't computed.
# Schematic
![Schematic in SVG format](Schematic/t1-schematic.svg){ width=16.5cm height=11.7cm }
# PCB Layers
![PCB Front copper](PCB/SVG/t1-assembly_page_01.svg){ width=16.5cm height=11.7cm }
![PCB No description](PCB/SVG/t1-assembly_page_02.svg){ width=16.5cm height=11.7cm }
![PCB No description](PCB/SVG/t1-assembly_page_03.svg){ width=16.5cm height=11.7cm }
![PCB Bottom copper](PCB/SVG/t1-assembly_page_04.svg){ width=16.5cm height=11.7cm }
![PCB Bottom courtyard area](PCB/SVG/t1-assembly_page_05.svg){ width=16.5cm height=11.7cm }
![PCB Front courtyard area](PCB/SVG/t1-assembly_page_06.svg){ width=16.5cm height=11.7cm }
![PCB Bottom documentation](PCB/SVG/t1-assembly_page_07.svg){ width=16.5cm height=11.7cm }
![PCB Front documentation](PCB/SVG/t1-assembly_page_08.svg){ width=16.5cm height=11.7cm }